Photonic integrated circuit package

US10026723B2 · kind B2 · utility

Assignee

• Infinera Corp. · US

Inventors

• Peter W. Evans · Tracy, US
• John W. Osenbach · Kutztown, US
• Fred A. Kish, Jr. · Palo Alto, US
• Jiaming Zhang · New York, US
• Miguel Iglesias Olmedo · Sunnyvale, US
• Maria Anagnosti · Mountain View, US

Key dates

• Filing date: Jan 4, 2017
• Grant date: Jul 17, 2018
• Expiry date: Jan 4, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15323
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.