Spot heater and device for cleaning wafer using the same
US10029332B2 · kind B2 · utility
4Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2015 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | May 7, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.