External clamp ring for a chemical mechanical polishing carrier head
US10029346B2 · kind B2 · utility
1Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2016 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Jun 20, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An external clamp ring for a chemical mechanical polishing (CMP) carrier head having a hydrophobic coating, and a carrier head having the same are described herein. In one embodiment, an external clamp ring is provided that includes a cylindrical body having an outer cylindrical wall and an inner cylindrical wall. A hydrophobic layer disposed is on the outer cylindrical wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.