Techniques for determining local interconnect defects
US10032524B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2015 |
| Grant date | Jul 24, 2018 |
| Priority date | — |
| Expiry date | Mar 19, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/5006
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques are presented for the determination defects in non-volatile arrays, particularly those having a 3D or BiCS type of arrangement where NAND strings run in a vertical direction relative to the substrate. In such an arrangement, the NAND strings are formed along memory holes and connected to global bit lines, and are separated into blocks or sub-blocks by vertical local interconnects, such as for source lines, and connected to a corresponding global line. To determine defective blocks, a reference current is determined based on the amount of current drawn by the local interconnects when a high voltage is applied and all of the blocks are de-selected. The amount of leakage current is determined when a selected block is biased to ground and the high voltage is applied to the interconnects. By comparing the reference current to the leakage current, a determination can be made on whether the selected block has defects related to the local interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.