Enhanced productivity for an etch system through polymer management
US10037883B2 · kind B2 · utility
1Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2014 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Feb 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein generally relate to an apparatus and methods for reducing the deposition of polymers in a semiconductor processing chamber. A heater jacket and heat sources are provided and may be configured to maintain a uniform temperature profile of the processing chamber. A method of maintaining a uniform temperature profile of a dielectric ceiling of the processing chamber is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.