Electronic module comprising fluid cooling channel and method of manufacturing the same

US10037972B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Edward Fuergut · Nuremberg, DE
• Martin Gruber · Schwandorf, DE
• Wolfram Hable · Dresden, DE

Key dates

• Filing date: Apr 25, 2016
• Grant date: Jul 31, 2018
• Expiry date: Apr 25, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/401
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Various embodiments provide an electronic module comprising a interposer comprising a fluid channel formed in an electrically isolating material and an electrically conductive structured layer; at least one electronic chip attached to the electrically conductive layer and in thermal contact to the fluid channel; and a molded encapsulation formed at least partially around the at least one electronic chip, wherein the electrically conductive structured layer is directly formed on the electrically isolating material.