Inventor · Dresden, DE

Wolfram Hable

18Patents
3h-index
30Co-inventors
56Inventor score

Filing activity: Apr 1, 2003 → Dec 21, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9275926B2 Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip Electricity 19 Active
US10128165B2 Package with vertically spaced partially encapsulated contact structures Emerging Cross-Sectional Technologies 7 Active
US10074590B1 Molded package with chip carrier comprising brazed electrically conductive layers Electricity 5 Active
US9397018B2 Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit Electricity 3 Active
US9589922B2 Electronic module and method of manufacturing the same Emerging Cross-Sectional Technologies 3 Active
US7592696B2 Power module having at least two substrates Electricity 2 Active
US7176057B2 Power module comprising at least two substrates and method for producing the same Electricity 2 Expired
US9585241B2 Substrate, chip arrangement, and method for manufacturing the same Emerging Cross-Sectional Technologies 1 Active
US10037972B2 Electronic module comprising fluid cooling channel and method of manufacturing the same Electricity 1 Active
US10461017B2 Package with partially encapsulated cooling channel for cooling an encapsulated chip Electricity 1 Active
US10079195B2 Semiconductor chip package comprising laterally extending connectors Electricity 0 Active
US11244886B2 Package cooled with cooling fluid and comprising shielding layer Electricity 0 Active
US11955407B2 Electronic module including a semiconductor package connected to a fluid heatsink Electricity 0 Active
US10615097B2 Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet Electricity 0 Active
US11862533B2 Fluid-cooled package having shielding layer Electricity 0 Active
US9362193B2 Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit General 0 Revoked
US11574889B2 Power module comprising two substrates and method of manufacturing the same Electricity 0 Active
US10283432B2 Molded package with chip carrier comprising brazed electrically conductive layers Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.