Photonic integrated circuit package
US10037982B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2017 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | Jan 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15323
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.