Semiconductor device including landing pad for connecting substrate and capacitor
US10037999B2 · kind B2 · utility
8Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2015 |
| Grant date | Jul 31, 2018 |
| Priority date | — |
| Expiry date | May 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
A semiconductor device includes a substrate including an active region, a plurality of conductive line structures separate from the substrate, a plurality of contact plugs between the plurality of conductive line structures, a plurality of landing pads connected to a corresponding contact plug of the plurality of contact plugs, a landing pad insulation pattern between the plurality of landing pads, and a first insulation spacer between the landing pad insulation pattern and first conductive line structures from among the plurality of conductive line structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.