Patent · US Active

Using an integrated circuit die for multiple devices

US10043724B1 · kind B1 · utility

0Cited by

7References

9Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Brian C. Gaide · Glassboro, US
Nui Chong · San Jose, US

Key dates

Filing date	Nov 8, 2016
Grant date	Aug 7, 2018
Priority date	—
Expiry date	Nov 8, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/585
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an example, a semiconductor assembly includes an integrated circuit (IC) die. The IC die includes a first region that includes a programmable fabric; a second region that includes input/output (IO) circuits; and a third region that includes a die seal disposed between the programmable fabric and the IO circuits.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.