Electronic device package having a dielectric layer and an encapsulant

US10043782B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Edward Fuergut · Nuremberg, DE
• Holger Doepke · Sinzing, DE
• Olaf Hohlfeld · Warstein, DE
• Michael Juerss · Regenstauf, DE

Key dates

• Filing date: Mar 28, 2017
• Grant date: Aug 7, 2018
• Expiry date: Mar 28, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1377
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.