Holger Doepke
5Patents
2h-index
20Co-inventors
43Inventor score
Filing activity: Jan 20, 2016 → Feb 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10043782B2 | Electronic device package having a dielectric layer and an encapsulant | Electricity | 3 | Active |
| US10332814B2 | Bonded system and a method for adhesively bonding a hygroscopic material | Electricity | 2 | Active |
| US11804432B2 | Semiconductor device with polymer-based insulating material and method of producing thereof | Electricity | 0 | Active |
| US10056295B2 | Method for handling a product substrate, a bonded substrate system and a temporary adhesive | Emerging Cross-Sectional Technologies | 0 | Active |
| US10600690B2 | Method for handling a product substrate and a bonded substrate system | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.