Dual selective deposition
US10047435B2 · kind B2 · utility
440Cited by
52References
52Claims
0Family size
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Key dates
| Filing date | Apr 15, 2015 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Apr 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76849
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods are provided for dual selective deposition of a first material on a first surface of a substrate and a second material on a second, different surface of the same substrate. The selectively deposited materials may be, for example, metal, metal oxide, or dielectric materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.