Apparatus and method for thermal management in a multi-chip package
US10048744B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2014 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Oct 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a processor includes a first chip of a multi-chip package (MCP). The first chip includes at least one core and first chip temperature control (TC) logic to assert a first power adjustment signal at a second chip of the MCP responsive to an indication that a first chip temperature of the first chip exceeds a first threshold. The processor also includes a conduit that includes a bi-directional pin to couple the first chip to the second chip within the MCP. The conduit is to transport the first power adjustment signal from the first chip to the second chip and the first power adjustment signal is to cause an adjustment of a second chip power consumption of the second chip. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.