Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US10053793B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2015 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Nov 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are electroplating cups for holding, sealing, and providing electrical power to wafers during electroplating, where the electroplating cup can include a cup bottom, an elastomeric lipseal, and an electrical contact element. The cup bottom can include a radially inwardly protruding surface with a plurality of through-holes. The elastomeric lipseal can directly adhere to the radially inwardly protruding surface of the cup bottom, fill the plurality of through-holes, and encircle an inner edge of the cup bottom. In some implementations, this can mitigate the effects of wafer sticking. In some implementations, the cup bottom may be treated to promote adhesion between the elastomeric lipseal and the radially inwardly protruding surface of the cup bottom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.