Inventor · Portland, OR, US

Robert Rash

48Patents
13h-index
36Co-inventors
77Inventor score

Filing activity: Oct 30, 2007 → Mar 13, 2025

Most-cited inventions

PatentTitleAreaCited byStatus
USD648289S1 Electroplating flow shaping plate having offset spiral hole pattern General 47 Expired
US7985325B2 Closed contact electroplating cup assembly Chemistry; Metallurgy 27 Active
US7935231B2 Rapidly cleanable electroplating cup assembly Chemistry; Metallurgy 26 Active
US8603305B2 Electrolyte loop with pressure regulation for separated anode chamber of electroplating system Chemistry; Metallurgy 24 Active
US8172992B2 Wafer electroplating apparatus for reducing edge defects Chemistry; Metallurgy 21 Active
US8377268B2 Electroplating cup assembly Chemistry; Metallurgy 18 Active
US9624592B2 Cross flow manifold for electroplating apparatus Electricity 17 Active
US8398831B2 Rapidly cleanable electroplating cup seal Chemistry; Metallurgy 17 Active
US8858774B2 Electroplating apparatus for tailored uniformity profile Electricity 14 Active
US9523155B2 Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating Chemistry; Metallurgy 14 Active
US9834852B2 Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating Chemistry; Metallurgy 13 Active
US9394620B2 Control of electrolyte hydrodynamics for efficient mass transfer during electroplating Chemistry; Metallurgy 13 Active
US9752248B2 Methods and apparatuses for dynamically tunable wafer-edge electroplating Chemistry; Metallurgy 13 Active
US9221081B1 Automated cleaning of wafer plating assembly Physics 12 Active
US8475637B2 Electroplating apparatus with vented electrolyte manifold Chemistry; Metallurgy 11 Active
US10094034B2 Edge flow element for electroplating apparatus Chemistry; Metallurgy 10 Active
US9260793B2 Electroplating apparatus for tailored uniformity profile Electricity 10 Active
US9455139B2 Methods and apparatus for wetting pretreatment for through resist metal plating Electricity 9 Active
US9567685B2 Apparatus and method for dynamic control of plated uniformity with the use of remote electric current Chemistry; Metallurgy 9 Active
US10190230B2 Cross flow manifold for electroplating apparatus Electricity 6 Active
US9139927B2 Electrolyte loop with pressure regulation for separated anode chamber of electroplating system Chemistry; Metallurgy 6 Active
US10066311B2 Multi-contact lipseals and associated electroplating methods Chemistry; Metallurgy 5 Active
US9721800B2 Apparatus for wetting pretreatment for enhanced damascene metal filling Electricity 5 Active
US10053793B2 Integrated elastomeric lipseal and cup bottom for reducing wafer sticking Electricity 5 Active
US10092933B2 Methods and apparatuses for cleaning electroplating substrate holders Electricity 5 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.