Inspection apparatus, inspection method, lithographic apparatus, patterning device and manufacturing method
US10054862B2 · kind B2 · utility
3Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2016 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Jun 10, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70641
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a method of monitoring a focus parameter during a lithographic process. The method comprises acquiring first and second measurements of, respectively first and second targets, wherein the first and second targets have been exposed with a relative best focus offset. The method then comprises determining the focus parameter from first and second measurements. Also disclosed are corresponding measurement and lithographic apparatuses, a computer program and a method of manufacturing devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.