Patent · US Active

Post spacer self-aligned cuts

US10056291B2 · kind B2 · utility

1Cited by
3References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 23, 2016
Grant dateAug 21, 2018
Priority date
Expiry dateNov 23, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76816
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to post spacer self-aligned cut structures and methods of manufacture. The method includes: providing a non-mandrel cut; providing a mandrel cut; forming blocking material on underlying conductive material in the non-mandrel cut and the mandrel cut; forming trenches with the blocking material acting as a blocking mask at the mandrel cut and the non-mandrel cut; and filling the trenches with metallization features such that the metallization features have a tip to tip alignment.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.