Method and apparatus for analyzing and for removing a defect of an EUV photomask
US10060947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Dec 20, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/86
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention refers to a method for analyzing a defect of an optical element for the extreme ultra-violet wavelength range comprising at least one substrate and at least one multi-layer structure, the method comprising the steps: (a) determining first data by exposing the defect to ultra-violet radiation, (b) determining second data by scanning the defect with a scanning probe microscope, (c) determining third data by scanning the defect with a scanning particle microscope, and (d) com-bining the first, the second and the third data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.