Patent · US Active

Encapsulated semiconductor package and method of manufacturing thereof

US10062611B2 · kind B2 · utility

0Cited by

12References

20Claims

0Family size

Assignee

Amkor Technology, Inc. · US

Inventors

Bora Baloglu · Porto, PT
Curtis Zwenger · Chandler, US
Ron Huemoeller · Gilbert, US

Key dates

Filing date	Aug 22, 2017
Grant date	Aug 28, 2018
Priority date	—
Expiry date	Aug 22, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.