Scanning an object using multiple mechanical stages
US10068748B2 · kind B2 · utility
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16References
20Claims
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Key dates
| Filing date | Dec 7, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Dec 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for scanning an object, the method may include moving an object by a first mechanical stage that follows a first scan pattern; introducing multiple movements, by a second mechanical stage, between the object and the first mechanical stage while the first mechanical stage follows the first scan pattern; and obtaining, by optics, images of multiple suspected defects while the first mechanical stage follows the first scan pattern; wherein a weight of the first mechanical stage exceeds a weight of the second mechanical stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.