Surface-treated copper foil
US10070521B2 · kind B2 · utility
1Cited by
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16Claims
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Assignee
Inventor
Key dates
| Filing date | Mar 29, 2013 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Mar 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/273
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.