Ryo Fukuchi
13Patents
2h-index
8Co-inventors
39Inventor score
Filing activity: Dec 22, 2009 → Mar 27, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9724896B2 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Emerging Cross-Sectional Technologies | 7 | Active |
| US9060431B2 | Liquid crystal polymer copper-clad laminate and copper foil used for said laminate | Emerging Cross-Sectional Technologies | 5 | Active |
| US10070521B2 | Surface-treated copper foil | Emerging Cross-Sectional Technologies | 1 | Active |
| US10464291B2 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Emerging Cross-Sectional Technologies | 1 | Active |
| US8357307B2 | Method of forming electronic circuit | Electricity | 1 | Active |
| US10925171B2 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device | Emerging Cross-Sectional Technologies | 1 | Active |
| US10448507B2 | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna | Electricity | 0 | Active |
| US10791631B2 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Emerging Cross-Sectional Technologies | 0 | Active |
| US8668994B2 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same | Emerging Cross-Sectional Technologies | 0 | Active |
| US10383222B2 | Surface-treated copper foil | Electricity | 0 | Active |
| US10820414B2 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Emerging Cross-Sectional Technologies | 0 | Active |
| US10925170B2 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Emerging Cross-Sectional Technologies | 0 | Active |
| US8580390B2 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.