Integrated fan-out package and method of fabricating the same
US10074604B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2017 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Apr 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an integrated fan-out package is provided. The method includes the followings. An integrated circuit component is mounted on a carrier. An insulating encapsulation is formed on the carrier to encapsulate sidewalls of the integrated circuit component. A plurality of conductive pillars are formed on the integrated circuit component and a dielectric layer is formed to cover the integrated circuit component and the insulating encapsulation, wherein the plurality of conductive pillars penetrate through the dielectric layer and are electrically connected to the integrated circuit component. A redistribution circuit structure is formed on the dielectric layer and the plurality of conductive pillars, wherein the redistribution circuit structure is electrically connected to the integrated circuit component through the plurality of conductive pillars, and the redistribution circuit structure and the insulating encapsulation are spaced apart by the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.