Non-destructive 3-dimensional chemical imaging of photo-resist material
US10078204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2014 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | May 2, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/656
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments include devices, systems and processes for using a combined confocal Raman microscope for inspecting a photo resist film material layer formed on the top surface of a layer of a substrate package, to detect border defects between regions of light exposed (e.g., cured) and unexposed (e.g., uncured) resist film material. Use of the confocal Raman microscope may provide a 3D photo-resist chemical imaging and characterization technique based on combining (1) Raman spectroscopy to identify the borders between regions of light exposed and unexposed resist along XY planes, with (2) Confocal imaging to select a Z-height of the XY planes scanned. Such detection provides fast, high resolution, non-destructive in-line inspection, and improves technical development of polymerization profiles of the resist film material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.