Semiconductor device and manufacturing method thereof
US10079157B2 · kind B2 · utility
7Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.