Inventor · Seojong-myeon, KR

Doo Hyun Park

65Patents
12h-index
65Co-inventors
87Inventor score

Filing activity: Dec 12, 1995 → Sep 15, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7902660B1 Substrate for semiconductor device and manufacturing method thereof Electricity 148 Active
US8552556B1 Wafer level fan out package Electricity 94 Active
US9214434B1 Fan-out semiconductor package Electricity 54 Active
US6270649A Electrochemical methods for generation of a biological proton motive force and pyridine nucleotide cofactor regeneration Emerging Cross-Sectional Technologies 50 Expired
US9000586B2 Semiconductor device and manufacturing method thereof Electricity 40 Active
US5976719A Mediator-less biofuel cell Emerging Cross-Sectional Technologies 35 Expired
US5661338A Chip mounting plate construction of lead frame for semiconductor package Electricity 34 Expired
US7202554B1 Semiconductor package and its manufacturing method Electricity 26 Expired
US9048125B2 Semiconductor device and manufacturing method thereof Electricity 20 Active
US7250288B2 Electrode compositions and configurations for electrochemical bioreactor systems Emerging Cross-Sectional Technologies 19 Expired
US8089159B1 Semiconductor package with increased I/O density and method of making the same Electricity 17 Active
US9484331B2 Semiconductor device and manufacturing method thereof Electricity 17 Active
US9418922B2 Semiconductor device with reduced thickness Electricity 10 Active
US9219042B2 Semiconductor device and manufacturing method thereof Electricity 8 Active
US9627368B2 Semiconductor device using EMC wafer support system and fabricating method thereof Electricity 8 Active
US9391043B2 Semiconductor device and manufacturing method thereof Electricity 8 Active
US10079157B2 Semiconductor device and manufacturing method thereof Emerging Cross-Sectional Technologies 7 Active
US10224217B1 Wafer level fan out package and method of fabricating wafer level fan out package Electricity 6 Active
US9478517B2 Electronic device package structure and method of fabricating the same Emerging Cross-Sectional Technologies 5 Active
US9966276B2 Semiconductor device and manufacturing method thereof Electricity 4 Active
US8227921B1 Semiconductor package with increased I/O density and method of making same Electricity 4 Active
US6822323B1 Semiconductor package having more reliable electrical conductive patterns Electricity 4 Expired
US10535536B2 Stiffener package and method of fabricating stiffener package Electricity 3 Active
US9818685B2 Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Electricity 3 Active
US9536858B2 Semiconductor device and manufacturing method thereof Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.