Patent · US Active

Semiconductor chip package comprising laterally extending connectors

US10079195B2 · kind B2 · utility

0Cited by

8References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Wolfram Hable · Dresden, DE
Martin Gruber · Schwandorf, DE
Juergen Hoegerl · Regensburg, DE

Key dates

Filing date	Oct 13, 2016
Grant date	Sep 18, 2018
Priority date	—
Expiry date	Oct 13, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH02M7/003
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip package is disclosed. The package includes a carrier, a plurality of semiconductor chips disposed on the carrier, a first encapsulation layer disposed above the semiconductor chips. A metallization layer is disposed above the first encapsulation layer, the metallization layer including a plurality of first metallic areas forming electrical connections between selected ones of the semiconductor chips. A second encapsulation layer is disposed above the solder resist layer. A plurality of external connectors are provided, each one of the external connectors being connected with one of the first metallic areas and extending outwardly through a surface of the second encapsulation layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.