Apparatus for treating substrates using supercritical fluids, substrate treatment system including the same and method of treating substrates using the same
US10083829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2016 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Mar 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are an apparatus for treating a substrate and a method of treating substrates. The apparatus includes an inlet valve through which a supercritical fluid flows into the process chamber until an inner pressure of the process chamber reaches a first pressure and a turbulent flow generator turbulently supplementing the supercritical fluid into the process chamber until the inner pressure of the process chamber is recovered to the first pressure. A pressure drop module partially removes a supercritical mixture from the process chamber until the inner pressure of the process chamber is dropped to the second pressure. A pressure drop mode and a supplemental mode may be alternately repeated by the flow controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.