Method and device for surface treatment of substrates
US10083854B2 · kind B2 · utility
3Cited by
9References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 2014 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Jun 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.