Markus Wimplinger
68Patents
6h-index
19Co-inventors
65Inventor score
Filing activity: Nov 7, 2008 → Dec 19, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8640548B2 | Apparatus, device and method for determining alignment errors | Electricity | 21 | Active |
| US9312161B2 | Accommodating device for retaining wafers | Electricity | 19 | Active |
| US8975158B2 | Method for permanently bonding wafers | Electricity | 6 | Active |
| US10008424B2 | Measuring device and method for measuring layer thicknesses and defects in a wafer stack | Electricity | 6 | Active |
| US10279575B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 6 | Active |
| US10325798B2 | Accommodating device for retaining wafers | Electricity | 6 | Active |
| US9067363B2 | Method and device for permanent bonding of wafers, as well as cutting tool | Emerging Cross-Sectional Technologies | 6 | Active |
| US9899223B2 | Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substrates | Electricity | 3 | Active |
| US9159717B2 | Method for permanently bonding wafers | Electricity | 3 | Active |
| US8449716B2 | Device and method for separating a substrate from a carrier substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US10163681B2 | Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation | Electricity | 3 | Active |
| US10083854B2 | Method and device for surface treatment of substrates | Electricity | 3 | Active |
| US9478518B2 | Method for permanent connection of two metal surfaces | Electricity | 3 | Active |
| US10964562B2 | Device and method for bonding of two substrates | Electricity | 3 | Active |
| US11990463B2 | Device for bonding chips | Electricity | 2 | Active |
| US9116424B2 | Device for embossing of substrates | Performing Operations; Transporting | 2 | Active |
| US10109538B2 | Measuring device and method for measuring layer thicknesses and defects in a wafer stack | Electricity | 2 | Active |
| US8763239B2 | System for uniform structuring of substrates | Emerging Cross-Sectional Technologies | 2 | Active |
| US8927335B2 | Method for bonding of chips on wafers | Electricity | 2 | Active |
| US10886156B2 | Accomodating device for retaining wafers | Electricity | 2 | Active |
| US9627349B2 | Method for applying a bonding layer | Electricity | 2 | Active |
| US10239253B2 | Method for embossing of substrates | Performing Operations; Transporting | 2 | Active |
| US11276589B2 | Device and method for bonding of two substrates | Electricity | 2 | Active |
| US9947638B2 | Device and method for permanent bonding | Electricity | 2 | Active |
| US11059280B2 | Device and method for bonding substrates | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.