Wafer processing equipment having capacitive micro sensors
US10083883B2 · kind B2 · utility
6Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2016 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Jun 20, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2015/1029
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an embodiment, a particle monitoring device for particle detection includes several capacitive micro sensors mounted on a wafer substrate to detect particles under all pressure regimes, e.g., under vacuum conditions. In an embodiment, one or more capacitive micro sensors is mounted on a wafer processing tool to measure material deposition and removal rates in real-time during the wafer fabrication process. Other embodiments are also described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.