Semiconductor package with heat slug and rivet free die attach area

US10083899B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Mohd Kahar Bajuri · Melaka City, MY
• Edmund Sales Cabatbat · Roxas, PH
• Gaylord Evangelista Cruz · Muntinlupa, PH
• Amirul Afiq Hud · Melaka City, MY
• Teck Sim Lee · Melaka City, MY
• Norbert Joson Santos · Baguio, PH
• Chiew Li Tai · Melaka City, MY
• CHIN-WEI YANG · New Taipei, TW

Key dates

• Filing date: Jan 23, 2017
• Grant date: Sep 25, 2018
• Expiry date: Jan 23, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.