Apparatus for purging semiconductor process chamber slit valve opening

US10090174B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• Panya Wongsenakhum · San Francisco, US
• Peter Krotov · San Jose, US

Key dates

• Filing date: Mar 1, 2016
• Grant date: Oct 2, 2018
• Expiry date: Mar 22, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/334
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A semiconductor processing chamber is provided and may include a wafer transfer passage that extends through a chamber wall and has an inner passage surface defining an opening, an insert including an insert inner surface defining an insert opening, and a gas inlet. A first recessed surface of the wafer transfer passage extending at least partially around and outwardly offset from the inner passage surface, a first insert outer surface extending at least partially around and outwardly offset from the insert inner surface, and a first wall surface extending between the inner passage surface and the first recessed surface, at least partially define a gas distribution channel fluidically connected to the gas inlet, the first recessed surface is separated from the first insert outer surface by a first distance and an insert front surface faces and is separated from the first wall surface by a first gap distance.