Patent · US Active

Method for producing a circuit carrier and for connecting an electrical conductor to a metallization layer of a circuit carrier

US10092974B2 · kind B2 · utility

0Cited by

1References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Mark Essert · Lippstadt, DE
Marianna Nomann · Ottobeuren, DE
Thomas Nuebel · Warstein, DE
Guido Strotmann · Uchte, DE

Key dates

Filing date	Jun 26, 2015
Grant date	Oct 9, 2018
Priority date	—
Expiry date	Jun 11, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0285
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

One aspect of the invention relates to a method for producing a circuit carrier. For this purpose, an electrically insulating carrier is provided, having an upper side and also an underside opposite from the upper side. A first metal foil and a hardening material are likewise provided. Then, an upper metallization layer, which is arranged on the upper side and has a hardening area, is produced. In this case, at least one contiguous portion of the hardening area is created by at least part of the hardening material being diffused into the first metal foil.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.