Mark Essert
4Patents
2h-index
8Co-inventors
33Inventor score
Filing activity: Mar 10, 2008 → Jun 26, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7494389B1 | Press-fit-connection | Electricity | 17 | Active |
| US8134838B2 | Semiconductor module and method | Electricity | 3 | Active |
| US9000580B2 | Power semiconductor module with pressed baseplate and method for producing a power semiconductor module with pressed baseplate | Electricity | 1 | Active |
| US10092974B2 | Method for producing a circuit carrier and for connecting an electrical conductor to a metallization layer of a circuit carrier | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.