Monitoring electrolytes during electroplating
US10094038B2 · kind B2 · utility
1Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2015 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Apr 26, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of and apparatuses for monitoring electroplating bath quality in electroplating cells using voltage readings are described herein. Methods involve obtaining real-time voltage readings during an electroplating process and determining whether the voltage readings are within a threshold deviation of an expected voltage reading at a given time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.