Optimizing the utilization of metrology tools
US10095121B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2016 |
| Grant date | Oct 9, 2018 |
| Priority date | — |
| Expiry date | Jan 20, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and corresponding metrology modules and systems, which measure metrology parameter(s) of a previous layer of a metrology target and/or an alignment mark, prior to producing a current layer of the metrology target, derive merit figure(s) from the measured metrology parameter(s) to indicate an inaccuracy, and compensate for the inaccuracy to enhance subsequent overlay measurements of the metrology target. In an example embodiment, methods and corresponding metrology modules and systems use stand-alone metrology tool(s) and track-integrated metrology tool(s) at distinct measurement patterns to address separately different aspects of variation among wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.