Patent · US Active

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

US10100421B2 · kind B2 · utility

0Cited by

14References

8Claims

0Family size

Assignees

DOW GLOBAL TECHNOLOGIES LLC · US
Rohm and Haas Electronic Materials LLC · US

Inventors

Matthew Thorseth · Westminster, US
Zuhra I. Niazimbetova · Westborough, US
Yi Qin · Mountain View, US
Julia Woertink · Midland, US
Joanna Dziewiszek · Boxborough, US
Erik Reddington · Ashland, US
Mark Lefebvre · Hudson, US

Key dates

Filing date	Jul 27, 2016
Grant date	Oct 16, 2018
Priority date	—
Expiry date	Dec 6, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09209
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.