Metrology apparatus, method of measuring a structure and lithographic apparatus
US10101675B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Feb 28, 2017 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Mar 17, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2207/129
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a metrology apparatus and method for measuring a structure formed on a substrate by a lithographic process. The metrology apparatus comprises an illumination system operable to provide measurement radiation comprising a plurality of wavelengths; and a hyperspectral imager operable to obtain a hyperspectral representation of a measurement scene comprising the structure, or a part thereof, from scattered measurement radiation subsequent to the measurement radiation being scattered by the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.