Apparatus and method for manufacturing a semiconductor device
US10103040B1 · kind B1 · utility
450Cited by
784References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2017 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Mar 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67303
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to an apparatus for manufacturing a semiconductor device comprising a reaction chamber comprising a substrate holder for holding a substrate; and, a heater for heating the substrate. The heater may comprise a vertical cavity surface emitting laser constructed and arranged to emit a radiation beam to a substrate held by the substrate holder to heat the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.