Buffer chamber wafer heating mechanism and supporting robot

US10103046B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• William T. Weaver · Austin, US
• Jason M. Schaller · Austin, US
• Robert Brent Vopat · Austin, US
• David Blahnik · Round Rock, US
• Benjamin B. Riordon · Newburyport, US
• Paul E. Pergande · Beverly Hills, US

Key dates

• Filing date: Apr 15, 2016
• Grant date: Oct 16, 2018
• Expiry date: Jul 23, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68771
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.