Chip package structure and method for forming the same
US10103125B2 · kind B2 · utility
8Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2016 |
| Grant date | Oct 16, 2018 |
| Priority date | — |
| Expiry date | Nov 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film is electrically connected to the first ground bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.