Methods of manufacturing multi-die semiconductor device packages and related assemblies

US10103134B2 · kind B2 · utility

Inventors

• Wei Zhou · Nanhu, CN
• Aibin Yu · Singapore, SG
• Zhaohui Ma · Boise, US
• Sony Varghese · Attleboro, US
• Jonathan S. Hacker · Meridian, US
• Bret K. Street · Meridian, US
• Shijian Luo · Boise, US

Key dates

• Filing date: Oct 9, 2017
• Grant date: Oct 16, 2018
• Expiry date: Oct 9, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/18161
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods of making semiconductor device packages may involve attaching a first semiconductor die to a carrier wafer, an inactive surface of the first semiconductor die facing the carrier wafer. One or more additional semiconductor die may be stacked on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer to form a stack of semiconductor dice. A protective material may be positioned over the stack of semiconductor dice, a portion of the protective material extending along side surfaces of the first semiconductor die to a location proximate the inactive surface of the first semiconductor die. The carrier wafer may be detached from the first semiconductor die.