Inventor · Boise, ID, US

Zhaohui Ma

19Patents
3h-index
19Co-inventors
53Inventor score

Filing activity: Apr 24, 2012 → Jan 19, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9202714B2 Methods for forming semiconductor device packages Electricity 8 Active
US9349670B2 Semiconductor die assemblies with heat sink and associated systems and methods Electricity 7 Active
US9589933B2 Methods of processing wafer-level assemblies to reduce warpage, and related assemblies Electricity 4 Active
US9865578B2 Methods of manufacturing multi-die semiconductor device packages and related assemblies Electricity 3 Active
US9786612B2 Methods of processing wafer-level assemblies to reduce warpage, and related assemblies Electricity 2 Active
US10312226B2 Semiconductor devices comprising protected side surfaces and related methods Electricity 2 Active
US9786643B2 Semiconductor devices comprising protected side surfaces and related methods Electricity 2 Active
US9716019B2 Semiconductor die assemblies with heat sink and associated systems and methods Electricity 2 Active
US10103134B2 Methods of manufacturing multi-die semiconductor device packages and related assemblies Electricity 1 Active
US11705425B2 Thermocompression bond tips and related apparatus and methods Electricity 0 Active
US10923448B2 Bond pad with micro-protrusions for direct metallic bonding Electricity 0 Active
US10153178B2 Semiconductor die assemblies with heat sink and associated systems and methods Electricity 0 Active
US12087719B2 Bond pad with micro-protrusions for direct metallic bonding Electricity 0 Active
US11024595B2 Thermocompression bond tips and related apparatus and methods Electricity 0 Active
US10734370B2 Methods of making semiconductor devices Electricity 0 Active
US9337064B2 Methods of protecting peripheries of in-process semiconductor wafers and related in-process wafers and systems Electricity 0 Active
US12262731B2 Cut-stem separating and baffling apparatus and primary air separation apparatus Performing Operations; Transporting 0 Active
US10636678B2 Semiconductor die assemblies with heat sink and associated systems and methods Electricity 0 Active
US11670612B2 Method for solder bridging elimination for bulk solder C2S interconnects Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.