Inventor · Meridian, ID, US

Jonathan S. Hacker

23Patents
3h-index
15Co-inventors
56Inventor score

Filing activity: Oct 8, 2008 → Dec 12, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US9905527B1 Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology Electricity 14 Active
US9865578B2 Methods of manufacturing multi-die semiconductor device packages and related assemblies Electricity 3 Active
US10396052B2 Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology Electricity 3 Active
US10002840B1 Semiconductor devices having discretely located passivation material, and associated systems and methods Electricity 2 Active
US7798674B2 Cover device for compact flourescent lamps Emerging Cross-Sectional Technologies 2 Active
US10763131B2 Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods Electricity 2 Active
US10622223B2 Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods Electricity 2 Active
US11527505B2 Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology Electricity 1 Active
US11923329B2 Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology Electricity 1 Active
US10103134B2 Methods of manufacturing multi-die semiconductor device packages and related assemblies Electricity 1 Active
US11004697B2 Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods Electricity 1 Active
US10446431B2 Temporary carrier debond initiation, and associated systems and methods Emerging Cross-Sectional Technologies 0 Active
US10852344B2 Inductive testing probe apparatus for testing semiconductor die and related systems and methods Electricity 0 Active
US10748857B2 Die features for self-alignment during die bonding Electricity 0 Active
US11094684B2 Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography Electricity 0 Active
US10403618B2 Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography Electricity 0 Active
US11402426B2 Inductive testing probe apparatus for testing semiconductor die and related systems and methods Electricity 0 Active
US11565371B2 Systems and methods for forming semiconductor cutting/trimming blades Performing Operations; Transporting 0 Active
US10262961B2 Semiconductor devices having discretely located passivation material, and associated systems and methods Electricity 0 Active
US10896886B2 Semiconductor devices having discretely located passivation material, and associated systems and methods Electricity 0 Active
US11955346B2 Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods Electricity 0 Active
US11302653B2 Die features for self-alignment during die bonding Electricity 0 Active
US10847486B2 Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.