Laminate substrate thermal warpage prediction for designing a laminate substrate
US10108753B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2016 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Apr 20, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Method of designing a laminate substrate having upper laminate layers and an equal plurality of lower laminate layers including: dividing the laminate substrate into regions having corresponding laminate layer pairs consisting of an upper laminate layer and a lower laminate layer; calculating a net stretching value for each corresponding laminate layer pair in each region to result in net stretching values in each region; summing the net stretching values in each region to result in a net stretching value for each region proportional to a curvature of each local region; calculating a relative out-of-plane displacement for the laminate substrate from the curvature of each local region; calculating a predicted thermal warpage for the laminate substrate; and finalizing a design of the laminate substrate when the predicted thermal warpage is within a predetermined acceptable range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.