Methods of detecting faults in real-time for semiconductor wafers
US10109046B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2016 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Jan 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems for and methods of detecting faults in semiconductor wafers are provided. One method includes, for instance: monitoring, with at least one sensor, a recipe for manufacturing a semiconductor wafer; tracking, with a fault detection system, a set of steps for the recipe; determining a start of a step; sensing a set of data related to at least one parameter of the step; generating, by an imaging system, an image of the set of data; displaying, on a display, the image of the set of data; calculating, by the fault detection system, a pixel area ratio from the image of the set of data; determining if a fault exists in the wafer based upon the pixel area ratio; and displaying, on the display, an indication of the fault during real-time and at an end of the step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.