Method of manufacturing semiconductor package device
US10109503B2 · kind B2 · utility
0Cited by
6References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2012 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Jul 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a carrier. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.