Inventor · Singapore, SG

Jimmy Chew

11Patents

2h-index

6Co-inventors

47Inventor score

Filing activity: Aug 21, 2001 → Sep 6, 2021

Most-cited inventions

Patent	Title	Area	Cited by	Status
US6550666B2	Method for forming a flip chip on leadframe semiconductor package	Electricity	210	Expired
US7692440B2	Handler for semiconductor singulation and method therefor	Emerging Cross-Sectional Technologies	2	Expired
US11114315B2	Chip packaging method and package structure	Electricity	2	Active
US10763133B2	Semiconductor structure and semiconductor package device using the same	Electricity	0	Active
US11538695B2	Packaging method, panel assembly, wafer package and chip package	Electricity	0	Active
US11233028B2	Chip packaging method and chip structure	Electricity	0	Active
US11232957B2	Chip packaging method and package structure	Electricity	0	Active
US12080565B2	Chip packaging method and package structure	Electricity	0	Active
US11610855B2	Chip packaging method and package structure	Electricity	0	Active
US11062917B2	Packaging method, panel assembly, wafer package and chip package	Electricity	0	Active
US10109503B2	Method of manufacturing semiconductor package device	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.